Handler (237), Kit for DIL 300 and DIL 600.
Handler (119), High/low temperature, DIL 300 adapter.
Cryo-head + compressor (239).
Mask Aligner (104), 3 wafer.
Mask Aligner (114), 3 Si wafer, possibility of conversion up to 4 .
Sputtering System (188), with load lock system.
Wire Bonder (163), Gold Ball 18 ?m.
Wire Bonder (120), Hybrid.
Wire Bonder (125), Hybrid 4 x 4 .
