Leybold-Heraeus RGD 210
Cryo-head + compressor (239).
Cryo-head + compressor (239).
Mask Aligner (104), 3 wafer.
Mask Aligner (114), 3 Si wafer, possibility of conversion up to 4 .
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Sputtering System (188), with load lock system.
Wire Bonder (120), Hybrid.
Wire Bonder (125), Hybrid 4 x 4 .
Automatický tester Si dosiek (171), 6 XY pohyb, 6 stolík.
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