Karl Suss MJB 21
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Sputtering System (188), with load lock system.
Wire Bonder (163), Gold Ball 18 ?m.
Wire Bonder (120), Hybrid.
Wire Bonder (125), Hybrid 4 x 4 .
Automatický tester Si dosiek (171), 6 XY pohyb, 6 stolík.
- Esec
- ASM AB 502
Esec 2004 Die Bonder (106), Hybrid, 4 x4
- Balzers DIF 160 - Balzers DIF 250