Karl Suss MA 56
Mask Aligner (114), 3 Si wafer, possibility of conversion up to 4 .
Mask Aligner (114), 3 Si wafer, possibility of conversion up to 4 .
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Sputtering System (188), with load lock system.
Wire Bonder (163), Gold Ball 18 ?m.
Wire Bonder (120), Hybrid.
Automatický tester Si dosiek (171), 6 XY pohyb, 6 stolík.
- Esec
- ASM AB 502
Esec 2004 Die Bonder (106), Hybrid, 4 x4