Hughes 2460-II
Wire Bonder (125), Hybrid 4 x 4 .
Wire Bonder (125), Hybrid 4 x 4 .
Wire Bonder (120), Hybrid.
Wire Bonder (163), Gold Ball 18 ?m.
Sputtering System (188), with load lock system.
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Mask Aligner (104), 3 wafer.
Mask Aligner (103), 3 wafer.
Cryo-head + compressor (239).
Indexer (238), for Esec 2005.
Handler (119), High/low temperature, DIL 300 adapter.