Wire Bonder (163), Gold Ball 18 ?m.
Sputtering System (188), with load lock system.
Mask Aligner (118), Basic machine up to 3 Si wafer, 2 in our configuration.
Mask Aligner (114), 3 Si wafer, possibility of conversion up to 4 .
Mask Aligner (104), 3 wafer.
Cryo-head + compressor (239).
Indexer (238), for Esec 2005.
Handler (119), High/low temperature, DIL 300 adapter.
Handler (237), Kit for DIL 300 and DIL 600.
Die Bonder (106), Hybrid, 4 x4
